April 12, 2021
Today’s PCBs consist of four layers, the lowest being a fiberglass substrate that provides support to the board. On top of it lies the conductive copper foil or coating. A solder mask protects the copper layer, and a silkscreen forms the layer right on top. The main stages in the making of a PCB are listed below:
Circuit design: The circuit design is prepared as per the requirements, usually in the form of Gerber files.
CAM design: In this stage, the circuit design is processed for production. CAM reviews the files, verifies the order parameters, performs engineering reviews, creates the tools and sequences necessary for design, and queues the orders for manufacturing.
PCB manufacturing: Subsequent to CAM design, the necessary tracks are created on the board, and the excess copper is removed. The board area not to be soldered is protected with a layer of polymer resist, and the remaining areas are plated with solder, allowing for the easier mounting of components.
Component placing: Components may be placed on the board in two ways. In through-hole mounting, the leads of the components are inserted into the holes in the PCB. In surface-mount technology (SMT), the component is mounted onto the surface of the PCB.
Soldering and testing: Whether the components are placed by through-hole or surface mounting, they are soldered onto the PCB. Finally, a number of electrical tests are carried out on the PCB to ensure that it is running as expected.
The three types of soldering are wave, reflow and selective. Wave soldering is the preferred technique for soldering through-hole components. Reflow soldering is the most common technique in PCB manufacturing and lends itself to soldering SMT components. Selective soldering is an automated alternative to hand soldering and is preferred in cases where the tight spacing of components is required.
Soldering in an inert atmosphere (notably nitrogen) has become increasingly popular in recent times. The advantages are clear. Soldering in an atmosphere of high-purity nitrogen reduces oxidization and improves the flow properties of solder as well as the spreading behavior and wettability of solder, all of which contribute to high-quality solder connections.
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When wave soldering is performed in a nitrogen environment, either of two approaches can be employed: partial gas treatment or tunnel system.
Reflow soldering is primarily used in surface-mount technology (SMT), notably in fine pitch ball grade array (BGA) components. For this purpose, solder paste, which contains flux suspended with solder, is used.
Selective soldering depends on many factors such as the configuration of machine, the attributes of flux and the choice of nozzle.
Nitrogen is a necessity for many businesses, but having someone deliver nitrogen to your site is often expensive and unsafe.
Are Gas Cylinders my only option to get Nitrogen into my shop? - The simplest and satisfying answer is Yes! However realsitic answer is a big NO.